科研项目:
1. Manufacturing Technology of LPSO RS P/M Mg Alloys, Cross-Ministerial Strategic Innovation Promotion Program (SIP) funded by Cabinet Office, Government of Japan (CAO), 2014. 10 –2019. 03
2. Aircraft-Application Technology of LPSO RS P/M Mg Alloys, Research Program on “Advanced Materials & Process Development for Next-Generation Aircraft Structures” funded by the Ministry of Economy, Trade and Industry (METI), 2013. 09 –2016. 03
3. Technology Development for Next-generation Heat‐resistant Magnesium Alloys, Collaboration of Regional Entities for the Advancement of Technological ExcellenceKey, 2006.12-2011.11
4. Evaluation of Properties and Development of electric conduction Paste for Low Joining Temperature, 2004.12- 2006.01
5. Development of Filler Material with Low Thermal Expansion for Direct Bonding of Al2O3 to Metal, 2004.08-2005.10
6. Development of Joining Technology for Cu based Bulk Metallic Glasses, 2002.11-2005.08
7. Evaluation of Properties for Ultra Fine Solder Paste, Bumping and Surface Mounting Technology, 2004.08-2005.07
8. Development of Nano-Composite Materials using Control of Crystallization, 2002.10-2005.03
9. Database for Solderbility between Pb Free Solder Alloy and Coating Layer, 2001.11- 2004.09
10. Development of Solder paste for Micro Joining, 2001.12-2003.11
11. Development of Heat Sink using Brazing process for different Materials, 2002.04-2003.03
12. Evaluation of Properties for High clean and quality of Sn Based Solder Alloy, 2001.11-2002.10
13. Development of Manufacturing Technology of Hybrid Material by New Sinter Bonding Process, 1998.10-2001.09